This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License
|
||||||||
|
Paper Details
Paper Title
Layout Designing and Transient Analysis of Carry Lookahead Adder Using 300nm Technology-A Review
Authors
  Lily Kanoriya,  Aparna Gupta,  Dr. Soni Changlani
Abstract
Adders are not only used for addition but it is also important in multiplication, division, and in address calculation. Carry Look Ahead Adder is very efficient adder since it can save the time of propagating the carry bits. This paper discusses the design of an Integrated Circuit(IC) layout for different bits of Carry Look Ahead Adder using full custom method with 300nm scaling. The layout will be design by using an open source software namely electric VLSI design system. In order to produce the layout, the basic knowledge of fabrication process and IC design rule is necessary. The layout will go for Design Rule Check set by the electric VLSI design system to check for any design rule error. Both layout and schematic circuit of CLA were then going to simulate through Layout versus Schematic to ensure they both are identical. LT Spice IV will be used as a simulator to carry out the simulation work and verifying the validity of the circuit function. Through the correspondence of the layout design we can go for the analysis of transient and frequency response of CLA.
Keywords- Carry Look Ahead Adder (CLA), Schematic, IC Layout, Electric VLSI design system , LT Spice IV
Publication Details
Unique Identification Number - IJEDR1602084Page Number(s) - 467-472Pubished in - Volume 4 | Issue 2 | May 2016DOI (Digital Object Identifier) -    Publisher - IJEDR (ISSN - 2321-9939)
Cite this Article
  Lily Kanoriya,  Aparna Gupta,  Dr. Soni Changlani,   "Layout Designing and Transient Analysis of Carry Lookahead Adder Using 300nm Technology-A Review", International Journal of Engineering Development and Research (IJEDR), ISSN:2321-9939, Volume.4, Issue 2, pp.467-472, May 2016, Available at :http://www.ijedr.org/papers/IJEDR1602084.pdf
Article Preview
|
|
||||||
|